For citation:
Pisarev A. D., Busygin A. N., Bobylev A. N., Udovichenko S. Yu. 2017. “Combined Memristor-Diode Crossbar as a Memory Storage Base”. Tyumen State University Herald. Physical and Mathematical Modeling. Oil, Gas, Energy, vol. 3, no 4, pp. 142-149. DOI: 10.21684/2411-7978-2017-3-4-142-149
About the authors:
Alexander D. Pisarev, Cand. Sci. (Tech.), Associate Professor, Department of Applied and Technical Physics, School of Natural Sciences, University of Tyumen, Tyumen, Russia; Senior Researcher, Memristive Materials Laboratory, Center for Nature-Inspired Engineering, University of Tyumen, Tyumen, Russia;
spcb.doc@utmn.ru,
https://orcid.org/0000-0002-5602-3880Alexander N. Busygin, Cand. Sci. (Phys.-Math.), Associate Professor, Department of Applied and Technical Physics, School of Natural Sciences, University of Tyumen, Tyumen, Russia; Senior Researcher, Memristive Materials Laboratory, Center for Nature-Inspired Engineering, University of Tyumen, Tyumen, Russia;
a.n.busygin@utmn.ru,
https://orcid.org/0000-0002-3439-8067
Andrey N. Bobylev, Head of the Laboratory of Electronic and Probe Microscopy. REC “Nanotechnology”, University of Tyumen;
eLibrary AuthorID,
ScopusID,
andreaubobylev@gmail.com; ORCID:
0000-0001-5488-8736Sergey Yu. Udovichenko, Dr. Sci. (Phys.-Math.), Professor, Department of Applied and Technical Physics, School of Natural Sciences, University of Tyumen, Tyumen, Russia; Scientific Director of the Memristive Materials Laboratory, Center for Nature-Inspired Engineering, University of Tyumen, Tyumen, Russia;
udotgu@mail.ru,
https://orcid.org/0000-0003-3583-7081
Abstract:
This article presents the topology and manufacturing technology of the composite crossbar. A new electronics component includes an active memristive layer and a semiconductor layer of Zener diode. The layers and conductors can be manufactured in a simple industrial way — in a magnetron technological module. Simulation of the write operation in the cells of the composite crossbar shows that application of Zener diode improves energy efficiency. The new electronics component allows to create planar and 3D ultra large memory devices which can be part of a neuromorphic processor.